ISO 26262-7 clauses 5 and 6 require a production process for elements that bear on safety to be developed and maintained; semiconductors use standardized wafer processing and die assembly flows in which safety-related steps cannot be separated, so the whole process is treated as safety-related, with risk mitigation through process FMEA and control plans, device model libraries representing the technology, and manufacturing tests evaluating the element against its electrical specification and the process against its control plan; the production work products of part 7 can be met through a quality management system compliant with IATF 16949, and the guidance covers servicing, maintenance, repair and decommissioning of semiconductors where the component is not serviced in the field but replaced.
This control maps to 1 controls across 1 other frameworks. If you already hold one of them, the evidence you collected for it is the starting point here rather than new work.
Every mapping shown was judged rather than inferred from wording similarity, and the ones that failed review are published too. See the coverage reports and what was rejected.
The graph holds this control, the 1 it maps to, and the evidence behind each claim, over MCP and REST.