Multiple-chip embedded modules use a production-grade enclosure and a tamper-evident coating, potting or enclosure; multiple-chip standalone modules sit wholly in a metal or hard plastic production-grade enclosure. In both cases doors or covers are secured with pick-resistant locks or uniquely numbered tamper-evident seals; the enclosure is strong enough that removal or penetration very probably disables the module; a tamper detection envelope (for example serpentine flexible circuits, cover switches or motion detectors) detects cutting, drilling, milling, grinding or dissolving; tamper response circuitry continuously monitors it and immediately zeroises CSPs while CSPs are present; and the response circuitry is protected from disablement, or disabling it destroys or zeroises the CSPs.
The graph holds this control, the 0 it maps to, and the evidence behind each claim, over MCP and REST.